Second plasma etcher with cryo
PlasmaPro 100 Cobra 300 ICP
Publicerad 2021-04-13
During fall of 2021 there will be one more plasma etcher with cryo stage and ICP installed in Albanova Nanolab.
The Oxford PlasmaPro 100 Cobra 300 is a load locked plasma etcher with a cryo stage. Maximum wafer size is 200 mm. Etch rate is > 8 um/min with a 3 kW ICP RF generator. Selectivity for photoresist is > 120 (general Bosch process).